ACTEL M2S150T-FCG1152I
- SmartFusion2 SoC FPGA with 146,124 logic cells and hardened ARM Cortex-M3 at 166 MHz
- 65nm flash-based process — nonvolatile, instant-on, no external boot device required
- 4 x PCIe Gen2 lanes and up to 8 x 5G SERDES transceivers for high-bandwidth connectivity
- 1152-pin FCBGA package with up to 574 user I/O pins
- DDR3/DDR2/LPDDR1 memory controller with dual DDR interfaces
- Industrial-grade temperature range: –40°C to +85°C
When a design demands the highest logic density, the widest I/O count, and the most connectivity options in the SmartFusion2 family — all in a single industrial-grade device — the ACTEL M2S150T-FCG1152I is the answer. It combines 146,124 logic cells with a hardened ARM Cortex-M3 processor, four PCIe Gen2 endpoints, up to eight 5G SERDES lanes, and dual DDR memory controllers on a single 65nm flash-based chip. The 1152-pin FCBGA package unlocks up to 574 user I/O pins, making it the right choice for complex, high-pin-count system designs where a smaller package simply runs out of room.
The "T" designation places this device in the standard SmartFusion2 tier — sharing the same fabric, processor, and connectivity as the flagship M2S150 family, but without the additional SRAM-PUF security features of the TS variant. For designs where the priority is maximum logic capacity and I/O density rather than hardware-rooted key management, the M2S150T-FCG1152I delivers the full SmartFusion2 platform capability in the largest available package.
Related Products For Your Business
Some designs simply outgrow smaller packages. When a project needs the full logic density of the SmartFusion2 M2S150 combined with the highest available I/O count — for multi-channel sensor interfaces, dense backplane connections, or parallel memory buses — the ACTEL M2S150T-FCG1152I in the 1152-pin FCBGA package is where engineers land. It offers the same proven SmartFusion2 SoC platform as the smaller package variants, with the additional headroom that complex, I/O-intensive designs require.
M2S150T-FCG1152I: Maximum Connectivity in the SmartFusion2 Family
The M2S150T-FCG1152I sits at the top of the SmartFusion2 T-tier in terms of package size and I/O availability. Four PCIe Gen2 endpoints and up to eight 5G SERDES lanes make it genuinely competitive for communications infrastructure and data acquisition designs that would otherwise require discrete interface chips. The dual DDR memory controller — supporting DDR3, DDR2, and LPDDR1 — enables high-bandwidth external memory access on two independent channels, which matters for applications where data throughput between the FPGA fabric and external memory is a bottleneck. Backed by a hardened ARM Cortex-M3 and 512 KB of on-chip eNVM, firmware runs deterministically from nonvolatile storage without an external boot device.
M2S150T vs M2S150TS: Choosing the Right Variant
The most common selection question for this device is whether to use the T or TS variant. Both share identical logic density, processor, package options, and connectivity. The difference is security depth: the TS adds SRAM-PUF intrinsic key generation and active tamper response for information assurance applications. For designs where DPA-resistant AES and SHA-256 — which the T variant already includes — are sufficient, the M2S150T-FCG1152I is the right choice and avoids the added qualification considerations of the TS tier. For programs with explicit anti-tamper or secure key management mandates, the TS variant is the correct path.
Sourcing the ACTEL M2S150T-FCG1152I
The M2S150T-FCG1152I is an active-lifecycle device with strong demand across communications, industrial, and defense-adjacent programs. We carry verified inventory with full component traceability and can support both prototype quantities and production volume orders. Our team responds to inquiries within 24 hours with pricing, availability, and lead time — and can discuss long-term supply agreements for programs that need continuity. Contact us today to get a quote for the ACTEL M2S150T-FCG1152I.
- Largest package in the SmartFusion2 T-tier — 1152-pin FCBGA unlocks up to 574 user I/O pins
- Four PCIe Gen2 endpoints — more than any other SmartFusion2 package option
- Up to eight 5G SERDES lanes for high-bandwidth serial connectivity
- Dual DDR memory controller channels for maximum external memory throughput
- Flash*Freeze ultra-low power mode available — drops static power below 1 mW when idle
- Pin-compatible migration path available within the SmartFusion2 M2S150 family
- Supported by Microsemi Libero SoC design suite with dedicated IP cores
- Available with certificate of conformance and full supply chain traceability
Frequently Asked Questions (FAQ)
What Is the ACTEL M2S150T-FCG1152I and When Should I Use It?
The M2S150T-FCG1152I is the highest I/O count variant of the SmartFusion2 M2S150T — a SoC FPGA with 146,124 logic cells, a hardened ARM Cortex-M3, four PCIe Gen2 endpoints, and up to eight 5G SERDES lanes in a 1152-pin FCBGA package. It’s the right choice when a design requires the full SmartFusion2 logic capacity alongside the maximum number of available I/O pins.
What Is the Difference Between the M2S150T-FCG1152I and the M2S150TS-FCG1152I?
The core architecture, logic density, connectivity, and package are identical. The TS variant adds SRAM-PUF intrinsic key generation and active tamper detection for information assurance applications. If your program requires anti-tamper compliance or hardware-rooted key management beyond standard AES/SHA-256, the TS is the correct variant. Otherwise, the M2S150T-FCG1152I provides the full SmartFusion2 feature set at the standard tier.
How Many I/O Pins Does the M2S150T-FCG1152I Have?
The 1152-pin FCBGA package provides up to 574 user I/O pins — the highest available across all SmartFusion2 M2S150 package options. This includes MSIO, MSIOD, and DDRIO banks supporting mixed-voltage operation.
Does the M2S150T-FCG1152I Require an External Boot Device?
No. The flash-based nonvolatile architecture means the device powers up instantly with its configuration already loaded — no external PROM, SPI flash, or configuration memory is required. Firmware stored in the 512 KB on-chip eNVM is also nonvolatile and executes immediately at power-up.
How Do I Request a Quote for the ACTEL M2S150T-FCG1152I?
Submit an inquiry through our website contact form or email our sales team directly. We’ll respond within 24 hours with pricing, availability, and lead time — and can discuss volume pricing or long-term supply agreements if needed.