E2V TSPC603RMGH8LC
- Data Bus Width: 64b
- Max Frequency: 200MHz
- Min Operating Temperature: -55°C
- Max Operating Temperature: 125°C
- Core Architecture: PowerPC
- Radiation Hardening: No
E2V TSPC603RMGH8LC is a processor or DSP device. Review the exact-part parameters, package and temperature requirements before approving a source or alternate.
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TSPC603RMGH8LC Technical Overview: Verified Parameters Before Sourcing
E2V TSPC603RMGH8LC is a processor or DSP device cataloged in DSP & Processors, High-Speed ADC/DAC for Aerospace & Defense, Avionics Systems, Radar & Electronic Warfare, Satellite & Space programs. Unlike a family-level listing, the complete ordering code matters: package, temperature grade, speed option, screening level and shipment format can change with a suffix. The structured reference data for this exact part identifies Data Bus Width 64b, Max Frequency 200MHz, Min Operating Temperature -55°C, Max Operating Temperature 125°C.
These values are useful for initial BOM and sourcing review, but engineering approval should still use the latest manufacturer-controlled datasheet, package drawing and change notices. For availability, lot/date code and documentation, send Sparkle Electronics the complete TSPC603RMGH8LC requirement.
TSPC603RMGH8LC Key Specifications
| Parameter | TSPC603RMGH8LC |
|---|---|
| Data Bus Width | 64b |
| Max Frequency | 200MHz |
| Min Operating Temperature | -55°C |
| Max Operating Temperature | 125°C |
| Core Architecture | PowerPC |
| Radiation Hardening | No |
What the Specifications Mean in a Design Review
For this processor or DSP device, the main compatibility checks are processor architecture, clock rate, memory interface, peripheral set, software compatibility and thermal limits. A replacement should not be approved from the family name alone. The values below need to be checked against the schematic, PCB footprint, power tree, timing constraints, thermal analysis and program qualification baseline:
- Data Bus Width: 64b
- Max Frequency: 200MHz
- Min Operating Temperature: -55°C
- Max Operating Temperature: 125°C
- Core Architecture: PowerPC
- Radiation Hardening: No
Minimum and maximum values are not interchangeable with typical test values, and package-level compatibility does not guarantee pin, timing or firmware compatibility. Where the assembly is used in high-reliability equipment, confirm the required screening, traceability, lead finish and environmental documentation before purchase.
TSPC603RMGH8LC and Related E2V Devices
The following pages provide useful internal comparison points. They are related sourcing options, not automatically drop-in replacements:
- E2V 5962-8984103LA — compare the exact architecture, package, speed or grade before substitution.
- E2V EV12AQ600AVSH — compare the exact architecture, package, speed or grade before substitution.
- E2V 5962-8762901SA(IDT54FCT245EB) — compare the exact architecture, package, speed or grade before substitution.
- E2V TSPC603RMGU8LC — compare the exact architecture, package, speed or grade before substitution.
When comparing these devices, start with the exact function and architecture, then verify package and pinout, voltage rails, speed or bandwidth, operating temperature and qualification grade. If any of those differ, an engineering redesign or requalification may be required.
Package, Temperature and Ordering-Code Checks
The orderable code TSPC603RMGH8LC must be kept intact on the RFQ. Confirm the manufacturer marking, package drawing, terminal finish, moisture handling, operating-temperature requirement and packing format. For obsolete or long-stored material, define acceptable date codes and inspection criteria before quotation rather than after delivery.
Sourcing teams should also request the documentation appropriate to the program: Certificate of Conformance, packing and label photographs, lot/date-code information, traceability, visual inspection, X-ray or electrical testing when required. See our quality-control approach and the broader DSP & Processors, High-Speed ADC/DAC selection.
Applications and Procurement Context
TSPC603RMGH8LC may be evaluated for Aerospace & Defense, Avionics Systems, Radar & Electronic Warfare, Satellite & Space systems where its verified electrical limits, package and temperature range match the approved design. Typical work includes new production, repair, lifecycle extension and last-time-buy planning. Application labels describe catalog relevance; final suitability remains a system-level engineering decision.
Frequently Asked Questions
What are the main TSPC603RMGH8LC parameters?
The key reference values are Data Bus Width 64b, Max Frequency 200MHz, Min Operating Temperature -55°C, Max Operating Temperature 125°C. The complete table above should be reviewed together with the current manufacturer documentation and the operating conditions stated in that document.
Can another E2V part replace TSPC603RMGH8LC?
Not from the model name alone. Compare function, architecture, pinout, package, voltage, speed, temperature and qualification grade. The linked related devices are comparison starting points only.
What should be included in an RFQ?
Provide the exact part number, quantity, target delivery date, destination, acceptable date-code range and all documentation, screening or testing requirements. Submit the RFQ here.
Where can I review related components?
Browse DSP & Processors, High-Speed ADC/DAC and the relevant Aerospace & Defense, Avionics Systems, Radar & Electronic Warfare, Satellite & Space landing pages for other product families and sourcing guidance.
Need TSPC603RMGH8LC pricing, availability or traceability details? Contact Sparkle Electronics with the exact order code and procurement requirements.
