MICROSS AS8FLC1M32BQ-100IT
- Memory Type: Parallel boot-block flash module
- Density: 32 Mbit
- Organization: 1M × 32 bits
- Data Bus Width: 32 bits
- Package/Case: 68-pin ceramic quad flat package (BQ)
- Interface: Asynchronous parallel flash
- Supply Voltage: 3.3 V
- Access Time: 100 ns
- Boot-Block Layout: Bottom boot block (B suffix)
MICROSS AS8FLC1M32BQ-100IT is a memory device. Review the exact-part parameters, package and temperature requirements before approving a source or alternate.
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AS8FLC1M32BQ-100/IT Technical Overview: Verified Parameters Before Sourcing
MICROSS AS8FLC1M32BQ-100IT is a memory device cataloged in Memory & Storage for Aerospace & Defense, Satellite & Space programs. Unlike a family-level listing, the complete ordering code matters: package, temperature grade, speed option, screening level and shipment format can change with a suffix. The structured reference data for this exact part identifies Memory Type Parallel boot-block flash module, Density 32 Mbit, Organization 1M × 32 bits, Data Bus Width 32 bits.
These values are useful for initial BOM and sourcing review, but engineering approval should still use the latest manufacturer-controlled datasheet, package drawing and change notices. For availability, lot/date code and documentation, send Sparkle Electronics the complete AS8FLC1M32BQ-100/IT requirement.
AS8FLC1M32BQ-100/IT Key Specifications
| Parameter | AS8FLC1M32BQ-100/IT |
|---|---|
| Memory Type | Parallel boot-block flash module |
| Density | 32 Mbit |
| Organization | 1M × 32 bits |
| Data Bus Width | 32 bits |
| Package/Case | 68-pin ceramic quad flat package (BQ) |
| Interface | Asynchronous parallel flash |
| Supply Voltage | 3.3 V |
| Access Time | 100 ns |
| Boot-Block Layout | Bottom boot block (B suffix) |
| Operating Temperature | -40°C to +85°C industrial (/IT) |
| SMD Cross Reference | 5962-0920502HXA/HXC for qualified BQ version |
| Module Construction | Hermetic multi-chip module |
What the Specifications Mean in a Design Review
For this memory device, the main compatibility checks are density, organization, bus width, access time, voltage, interface timing and package pinout. A replacement should not be approved from the family name alone. The values below need to be checked against the schematic, PCB footprint, power tree, timing constraints, thermal analysis and program qualification baseline:
- Memory Type: Parallel boot-block flash module
- Density: 32 Mbit
- Organization: 1M × 32 bits
- Data Bus Width: 32 bits
- Package/Case: 68-pin ceramic quad flat package (BQ)
- Interface: Asynchronous parallel flash
- Supply Voltage: 3.3 V
Minimum and maximum values are not interchangeable with typical test values, and package-level compatibility does not guarantee pin, timing or firmware compatibility. Where the assembly is used in high-reliability equipment, confirm the required screening, traceability, lead finish and environmental documentation before purchase.
AS8FLC1M32BQ-100/IT and Related MICROSS Devices
The following pages provide useful internal comparison points. They are related sourcing options, not automatically drop-in replacements:
- MICROSS AS8F512K32PG-120/IT — compare the exact architecture, package, speed or grade before substitution.
- MICROSS AS29F040CW-90/IT — compare the exact architecture, package, speed or grade before substitution.
- MICROSS AS29F040CW-90/XT — compare the exact architecture, package, speed or grade before substitution.
When comparing these devices, start with the exact function and architecture, then verify package and pinout, voltage rails, speed or bandwidth, operating temperature and qualification grade. If any of those differ, an engineering redesign or requalification may be required.
Package, Temperature and Ordering-Code Checks
The orderable code AS8FLC1M32BQ-100/IT must be kept intact on the RFQ. Confirm the manufacturer marking, package drawing, terminal finish, moisture handling, operating-temperature requirement and packing format. For obsolete or long-stored material, define acceptable date codes and inspection criteria before quotation rather than after delivery.
Sourcing teams should also request the documentation appropriate to the program: Certificate of Conformance, packing and label photographs, lot/date-code information, traceability, visual inspection, X-ray or electrical testing when required. See our quality-control approach and the broader Memory & Storage selection.
Applications and Procurement Context
AS8FLC1M32BQ-100/IT may be evaluated for Aerospace & Defense, Satellite & Space systems where its verified electrical limits, package and temperature range match the approved design. Typical work includes new production, repair, lifecycle extension and last-time-buy planning. Application labels describe catalog relevance; final suitability remains a system-level engineering decision.
Frequently Asked Questions
What are the main AS8FLC1M32BQ-100/IT parameters?
The key reference values are Memory Type Parallel boot-block flash module, Density 32 Mbit, Organization 1M × 32 bits, Data Bus Width 32 bits. The complete table above should be reviewed together with the current manufacturer documentation and the operating conditions stated in that document.
Can another MICROSS part replace AS8FLC1M32BQ-100/IT?
Not from the model name alone. Compare function, architecture, pinout, package, voltage, speed, temperature and qualification grade. The linked related devices are comparison starting points only.
What should be included in an RFQ?
Provide the exact part number, quantity, target delivery date, destination, acceptable date-code range and all documentation, screening or testing requirements. Submit the RFQ here.
Where can I review related components?
Browse Memory & Storage and the relevant Aerospace & Defense, Satellite & Space landing pages for other product families and sourcing guidance.
Need AS8FLC1M32BQ-100/IT pricing, availability or traceability details? Contact Sparkle Electronics with the exact order code and procurement requirements.
