TI SMJ320VC33HFGM150

  • CPU: 32-bit C3x-compatible core
  • Package/Case: 164-pin ceramic low-profile quad flatpack (HFG)
  • Processor Type: 32-bit floating-point digital signal processor
  • Performance: 150 MFLOPS / 75 MIPS
  • Instruction Cycle: 13 ns
  • On-Chip SRAM: 34K × 32-bit dual-access SRAM
  • Core Supply: 1.8 V
  • I/O Supply: 3.3 V
  • Operating Temperature: -55°C to +125°C
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TI SMJ320VC33HFGM150 is a processor or DSP device. Review the exact-part parameters, package and temperature requirements before approving a source or alternate.

SMJ320VC33HFGM150 Technical Overview: Verified Parameters Before Sourcing

TI SMJ320VC33HFGM150 is a processor or DSP device cataloged in DSP & Processors for Aerospace & Defense, Industrial Control, Radar & Electronic Warfare programs. Unlike a family-level listing, the complete ordering code matters: package, temperature grade, speed option, screening level and shipment format can change with a suffix. The structured reference data for this exact part identifies CPU 32-bit C3x-compatible core, Package/Case 164-pin ceramic low-profile quad flatpack (HFG), Processor Type 32-bit floating-point digital signal processor, Performance 150 MFLOPS / 75 MIPS.

These values are useful for initial BOM and sourcing review, but engineering approval should still use the latest manufacturer-controlled datasheet, package drawing and change notices. For availability, lot/date code and documentation, send Sparkle Electronics the complete SMJ320VC33HFGM150 requirement.

SMJ320VC33HFGM150 Key Specifications

ParameterSMJ320VC33HFGM150
CPU32-bit C3x-compatible core
Package/Case164-pin ceramic low-profile quad flatpack (HFG)
Processor Type32-bit floating-point digital signal processor
Performance150 MFLOPS / 75 MIPS
Instruction Cycle13 ns
On-Chip SRAM34K × 32-bit dual-access SRAM
Core Supply1.8 V
I/O Supply3.3 V
Operating Temperature-55°C to +125°C
QualificationMilitary grade / SMD 5962-00539
PeripheralsSerial port, two 32-bit timers and DMA coprocessor
Process Technology0.18 µm CMOS

What the Specifications Mean in a Design Review

For this processor or DSP device, the main compatibility checks are processor architecture, clock rate, memory interface, peripheral set, software compatibility and thermal limits. A replacement should not be approved from the family name alone. The values below need to be checked against the schematic, PCB footprint, power tree, timing constraints, thermal analysis and program qualification baseline:

  • CPU: 32-bit C3x-compatible core
  • Package/Case: 164-pin ceramic low-profile quad flatpack (HFG)
  • Processor Type: 32-bit floating-point digital signal processor
  • Performance: 150 MFLOPS / 75 MIPS
  • Instruction Cycle: 13 ns
  • On-Chip SRAM: 34K × 32-bit dual-access SRAM
  • Core Supply: 1.8 V

Minimum and maximum values are not interchangeable with typical test values, and package-level compatibility does not guarantee pin, timing or firmware compatibility. Where the assembly is used in high-reliability equipment, confirm the required screening, traceability, lead finish and environmental documentation before purchase.

SMJ320VC33HFGM150 and Related TI Devices

The following pages provide useful internal comparison points. They are related sourcing options, not automatically drop-in replacements:

When comparing these devices, start with the exact function and architecture, then verify package and pinout, voltage rails, speed or bandwidth, operating temperature and qualification grade. If any of those differ, an engineering redesign or requalification may be required.

Package, Temperature and Ordering-Code Checks

The orderable code SMJ320VC33HFGM150 must be kept intact on the RFQ. Confirm the manufacturer marking, package drawing, terminal finish, moisture handling, operating-temperature requirement and packing format. For obsolete or long-stored material, define acceptable date codes and inspection criteria before quotation rather than after delivery.

Sourcing teams should also request the documentation appropriate to the program: Certificate of Conformance, packing and label photographs, lot/date-code information, traceability, visual inspection, X-ray or electrical testing when required. See our quality-control approach and the broader DSP & Processors selection.

Applications and Procurement Context

SMJ320VC33HFGM150 may be evaluated for Aerospace & Defense, Industrial Control, Radar & Electronic Warfare systems where its verified electrical limits, package and temperature range match the approved design. Typical work includes new production, repair, lifecycle extension and last-time-buy planning. Application labels describe catalog relevance; final suitability remains a system-level engineering decision.

Frequently Asked Questions

What are the main SMJ320VC33HFGM150 parameters?

The key reference values are CPU 32-bit C3x-compatible core, Package/Case 164-pin ceramic low-profile quad flatpack (HFG), Processor Type 32-bit floating-point digital signal processor, Performance 150 MFLOPS / 75 MIPS. The complete table above should be reviewed together with the current manufacturer documentation and the operating conditions stated in that document.

Can another TI part replace SMJ320VC33HFGM150?

Not from the model name alone. Compare function, architecture, pinout, package, voltage, speed, temperature and qualification grade. The linked related devices are comparison starting points only.

What should be included in an RFQ?

Provide the exact part number, quantity, target delivery date, destination, acceptable date-code range and all documentation, screening or testing requirements. Submit the RFQ here.

Where can I review related components?

Browse DSP & Processors and the relevant Aerospace & Defense, Industrial Control, Radar & Electronic Warfare landing pages for other product families and sourcing guidance.


Need SMJ320VC33HFGM150 pricing, availability or traceability details? Contact Sparkle Electronics with the exact order code and procurement requirements.

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