WEDC W764M32V1-110BM
- Memory Type: Embedded NOR Flash multi-chip package
- Density: 256 MB (2 Gbit)
- Organization: 64M × 32
- Temperature Grade: Military
- Package/Case: 107-ball PBGA
- Interface: Parallel NOR Flash
- Access Time: 110 ns
- Supply Voltage: 3.3 V
- Package Dimensions: 14 × 17 mm
WEDC W764M32V1-110BM is a memory device. Review the exact-part parameters, package and temperature requirements before approving a source or alternate.
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W764M32V1-110BM Technical Overview: Verified Parameters Before Sourcing
WEDC W764M32V1-110BM is a memory device cataloged in Memory & Storage for Aerospace & Defense, Satellite & Space programs. Unlike a family-level listing, the complete ordering code matters: package, temperature grade, speed option, screening level and shipment format can change with a suffix. The structured reference data for this exact part identifies Memory Type Embedded NOR Flash multi-chip package, Density 256 MB (2 Gbit), Organization 64M × 32, Temperature Grade Military.
These values are useful for initial BOM and sourcing review, but engineering approval should still use the latest manufacturer-controlled datasheet, package drawing and change notices. For availability, lot/date code and documentation, send Sparkle Electronics the complete W764M32V1-110BM requirement.
W764M32V1-110BM Key Specifications
| Parameter | W764M32V1-110BM |
|---|---|
| Memory Type | Embedded NOR Flash multi-chip package |
| Density | 256 MB (2 Gbit) |
| Organization | 64M × 32 |
| Temperature Grade | Military |
| Package/Case | 107-ball PBGA |
| Interface | Parallel NOR Flash |
| Access Time | 110 ns |
| Supply Voltage | 3.3 V |
| Package Dimensions | 14 × 17 mm |
| Mounting Type | Surface mount |
| Application | Boot, mission software and nonvolatile code storage |
| Product Family | W764M32V1-XBX |
What the Specifications Mean in a Design Review
For this memory device, the main compatibility checks are density, organization, bus width, access time, voltage, interface timing and package pinout. A replacement should not be approved from the family name alone. The values below need to be checked against the schematic, PCB footprint, power tree, timing constraints, thermal analysis and program qualification baseline:
- Memory Type: Embedded NOR Flash multi-chip package
- Density: 256 MB (2 Gbit)
- Organization: 64M × 32
- Temperature Grade: Military
- Package/Case: 107-ball PBGA
- Interface: Parallel NOR Flash
- Access Time: 110 ns
Minimum and maximum values are not interchangeable with typical test values, and package-level compatibility does not guarantee pin, timing or firmware compatibility. Where the assembly is used in high-reliability equipment, confirm the required screening, traceability, lead finish and environmental documentation before purchase.
W764M32V1-110BM and Related WEDC Devices
The following pages provide useful internal comparison points. They are related sourcing options, not automatically drop-in replacements:
- WEDC EDI88512CA20NI — compare the exact architecture, package, speed or grade before substitution.
- WEDC W3H64M72E-400BI — compare the exact architecture, package, speed or grade before substitution.
- WEDC WF1M32B-100G2UM3 — compare the exact architecture, package, speed or grade before substitution.
- WEDC EDI8L32512C12AC — compare the exact architecture, package, speed or grade before substitution.
When comparing these devices, start with the exact function and architecture, then verify package and pinout, voltage rails, speed or bandwidth, operating temperature and qualification grade. If any of those differ, an engineering redesign or requalification may be required.
Package, Temperature and Ordering-Code Checks
The orderable code W764M32V1-110BM must be kept intact on the RFQ. Confirm the manufacturer marking, package drawing, terminal finish, moisture handling, operating-temperature requirement and packing format. For obsolete or long-stored material, define acceptable date codes and inspection criteria before quotation rather than after delivery.
Sourcing teams should also request the documentation appropriate to the program: Certificate of Conformance, packing and label photographs, lot/date-code information, traceability, visual inspection, X-ray or electrical testing when required. See our quality-control approach and the broader Memory & Storage selection.
Applications and Procurement Context
W764M32V1-110BM may be evaluated for Aerospace & Defense, Satellite & Space systems where its verified electrical limits, package and temperature range match the approved design. Typical work includes new production, repair, lifecycle extension and last-time-buy planning. Application labels describe catalog relevance; final suitability remains a system-level engineering decision.
Frequently Asked Questions
What are the main W764M32V1-110BM parameters?
The key reference values are Memory Type Embedded NOR Flash multi-chip package, Density 256 MB (2 Gbit), Organization 64M × 32, Temperature Grade Military. The complete table above should be reviewed together with the current manufacturer documentation and the operating conditions stated in that document.
Can another WEDC part replace W764M32V1-110BM?
Not from the model name alone. Compare function, architecture, pinout, package, voltage, speed, temperature and qualification grade. The linked related devices are comparison starting points only.
What should be included in an RFQ?
Provide the exact part number, quantity, target delivery date, destination, acceptable date-code range and all documentation, screening or testing requirements. Submit the RFQ here.
Where can I review related components?
Browse Memory & Storage and the relevant Aerospace & Defense, Satellite & Space landing pages for other product families and sourcing guidance.
Need W764M32V1-110BM pricing, availability or traceability details? Contact Sparkle Electronics with the exact order code and procurement requirements.
