AVAGO HCPL-7851#300 (5962-9755701HXA)
- MIL-PRF-38534 Class H hermetic analog isolation amplifier in gull wing SMT configuration
- Full Class H lot screening: 100% electrical testing at −55°C, +25°C, and +125°C
- Identical electrical performance to HCPL-7851: 8.00 V/V gain, 0.1% nonlinearity, 100 kHz BW
- 8 kV/µs CMR at VCM = 1000V, 1,500Vdc isolation, dual 4.5V to 5.5V supply
- QML-38534 listed, DESC SMD 5962-9755701HXA, dual-marked for DLA procurement traceability
Avago Technologies (now Broadcom) makes the HCPL-7851 available in multiple lead configurations to accommodate the full range of defense PCB assembly processes — through-hole, butt joint, and gull wing SMT — each carrying identical MIL-PRF-38534 Class H qualification and QML-38534 traceability. The HCPL-7851#300 is the gull wing surface mount variant: the same hermetically sealed 8-pin ceramic DIP package as the standard HCPL-7851, with leads cut and formed into a gull wing profile for reflow SMT assembly and finished with solder dip. The HCPL-7851#300 is available from stock at Sparkle Electronics, a specialized hi-rel component distributor serving defense prime contractors, avionics OEMs, and government procurement offices requiring full lot documentation, conformance records, and DLA SMD traceability. The Class H gull wing SMD designation 5962-9755701HXA precisely identifies this lead configuration, qualification class, and lead finish within the DLA procurement system — eliminating specification ambiguity at the contract level.
The HCPL-7851#300 addresses a specific and recurring procurement challenge in defense avionics and power electronics programs: the need for MIL-PRF-38534 Class H qualified analog isolation in an assembly-process-compatible lead form for boards built exclusively to SMT manufacturing standards. Through-hole component insertion is increasingly excluded from modern high-density defense PCB assembly processes — in avionics line-replaceable units, shipboard electronics modules, and space vehicle power boards where mixed-technology assembly adds manufacturing complexity, qualification risk, and cost. The #300 gull wing option delivers full Class H qualification in a form factor that places and reflowsalongside every other SMT component on the assembly, with no process exception required. For programs requiring analog isolation with DLA QML traceability across avionics systems and aerospace and defense power electronics, the HCPL-7851#300 resolves both the qualification and assembly process requirements simultaneously. Contact Sparkle Electronics to confirm stock, lot availability, and documentation scope for your program.
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DESC SMD Number: 5962-9755701HXA
The HCPL-7851#300 is procurable under DESC Standard Microcircuit Drawing number 5962-9755701HXA — the fully qualified SMD designation specifying Class H screening, gull wing lead form, and solder-dipped lead finish within the 5962-97557 family. This level of specificity in the SMD number is deliberate: DLA procurement documentation for QML-38534 hybrid microcircuits requires unambiguous identification of not only the electrical device but the physical lead configuration and finish, as these parameters affect solderability qualification, board-level reliability, and acceptance inspection criteria.
The complete SMD numbering structure for the HCPL-785x family distinguishes lead configuration by suffix extension — HPC (standard through-hole, gold plate), HPA (standard through-hole, solder dip), HYC (butt joint, gold plate), HYA (butt joint, solder dip), HXA (gull wing, solder dip). Procurement teams sourcing 5962-9755701HXA in stock, verifying Class H gull wing analog isolation amplifier availability, or requiring MIL-PRF-38534 lot documentation for SMT-process defense boards can confirm inventory and documentation scope with Sparkle Electronics prior to order placement. Certificate of conformance, Class H screening test records, and country of origin documentation are available with each lot. Contact our team to confirm documentation requirements before placing your order.
Class H Qualification in an SMT Lead Form: Why Both Requirements Matter Simultaneously
Defense programs specifying analog isolation amplifiers for SMT-process boards face a procurement constraint that is straightforward in principle but frequently encountered in practice: the standard HCPL-7851 through-hole package carries the required Class H qualification but is incompatible with pure SMT assembly lines, while the commercial HCPL-7850#300 gull wing package is SMT-compatible but carries no Class H screening or QML-38534 traceability. The HCPL-7851#300 resolves this directly — Class H qualification, QML-38534 listing, and SMD traceability under 5962-9755701HXA, in a gull wing lead form that places and reflows without process exception. For procurement engineers searching HCPL-7851#300 in stock, 5962-9755701HXA Class H gull wing isolation amplifier, or MIL-PRF-38534 SMT analog isolation defense distributor, Sparkle Electronics maintains ready inventory with same-day response. Submit an inquiry for pricing, lot availability, and documentation confirmation within 24 hours.
Lead Configuration Comparison: HCPL-7851 Family
| Parameter | HCPL-7851#300 | HCPL-7851 (standard) | HCPL-7851#200 |
|---|---|---|---|
| Availability | In Stock at Sparkle | In Stock at Sparkle | Confirm with Sparkle |
| Lead Form | Gull wing | Through-hole | Butt joint |
| Assembly Method | SMT reflow | Through-hole insert | SMT butt joint |
| Lead Finish | Solder dipped | Gold plate | Gold plate |
| SMD Number | 5962-9755701HXA | 5962-9755701HPC | 5962-9755701HYC |
| Qualification | MIL-PRF-38534 Class H | MIL-PRF-38534 Class H | MIL-PRF-38534 Class H |
| QML-38534 | Yes | Yes | Yes |
| Electrical Specs | Identical | Identical | Identical |
| Temperature Screening | −55°C, +25°C, +125°C | −55°C, +25°C, +125°C | −55°C, +25°C, +125°C |
The gull wing (#300) suits standard SMT reflow assembly. The butt joint (#200) is used where component height above the board surface must be minimized. The standard through-hole is retained for legacy boards where SMT is not required or where wave soldering is part of the established qualified assembly process. All three carry identical electrical performance and full Class H lot screening — the procurement selection is determined entirely by the board assembly process qualification.
HCPL-7851#300 vs. HCPL-7850#300: Qualification Depth at the Same Assembly Process
| Parameter | HCPL-7851#300 | HCPL-7850#300 |
|---|---|---|
| Availability | In Stock at Sparkle | In Stock at Sparkle |
| Lead Form | Gull wing SMT | Gull wing SMT |
| Screening Class | MIL-PRF-38534 Class H | Commercial hermetic |
| Temperature Screening | −55°C, +25°C, +125°C | +25°C only |
| QML-38534 | Yes | No |
| SMD Number | 5962-9755701HXA | None |
| PIND Screening | Required | Not required |
| Die Shear Testing | Required | Not required |
| Lot Documentation | Full Class H package | Limited |
| Gain | 8.00 V/V ±5% | 8.00 V/V ±5% |
| Nonlinearity | 0.1% max | 0.1% max |
Both devices are electrically identical and use the same gull wing SMT assembly process. The procurement distinction is qualification depth: the HCPL-7851#300 provides the complete Class H screening record, PIND verification, die shear data, and QML-38534 lot traceability that defense contracts require; the AVAGO HCPL-7850#300 does not. For development and non-flight programs, the HCPL-7850#300 provides the same electrical performance with reduced procurement complexity. For production hardware under defense contracts with MIL-SPEC sourcing requirements, the HCPL-7851#300 under SMD 5962-9755701HXA is the required specification. Within the broader Sparkle Electronics hermetic isolation portfolio, the AVAGO HCPL-7851 (5962-97557) standard through-hole version and the AVAGO HCPL-7850 commercial hermetic version are available for programs with different assembly process or qualification requirements.
Frequently Asked Questions
What does HCPL-7851#300 decode to?
HCPL-7851 = MIL-PRF-38534 Class H hermetically sealed analog isolation amplifier (Avago/Broadcom); #300 = gull wing lead form option with solder-dipped finish for SMT reflow assembly. The DLA SMD designation 5962-9755701HXA encodes: 5962-97557 = base SMD drawing; 01 = device variant; H = Class H; X = gull wing lead form; A = solder-dipped lead finish.
Where can I buy HCPL-7851#300 in stock?
Sparkle Electronics maintains stock of the HCPL-7851#300 for defense and aerospace SMT procurement. Contact our team for current pricing, lot availability, and confirmed lead time. Same-day response on qualified inquiries — documentation scope and conformance record availability can be confirmed prior to order placement.
What documentation is supplied with the HCPL-7851#300?
Sparkle Electronics provides certificate of conformance, MIL-PRF-38534 Class H screening test records covering all required subgroups including temperature extremes, PIND, and die shear, along with lot traceability documentation and country of origin certification. Program-specific documentation requirements should be confirmed at inquiry stage.
Does the gull wing lead forming process affect the hermetic seal integrity?
No. Lead forming on hermetic ceramic DIP packages is performed using controlled tooling that applies bending force to the lead at a defined distance from the package body — outside the hermetic seal region. The forming process does not stress the ceramic-to-metal seal. Hermetic seal integrity is verified post-forming as part of the MIL-PRF-38534 Class H screening sequence prior to shipment.
Is HCPL-7851#300 suitable for space applications?
The HCPL-7851#300 under MIL-PRF-38534 Class H provides a strong qualification baseline. Space programs typically specify Class K or Class E with radiation hardness assurance data and additional lot acceptance testing beyond Class H requirements. Sparkle Electronics recommends confirming program-specific qualification requirements before committing to Class H for space-grade procurement. Contact us to discuss lot documentation and available test data for your specific application.
What is the solderability qualification for the solder-dipped lead finish?
The solder-dipped (Sn63/Pb37) lead finish on the #300 gull wing option meets the solderability requirements of MIL-STD-883 Method 2003. This finish provides reliable wetting during reflow soldering with standard SnPb or compatible lead-free solder pastes, and is specified in the DLA SMD 5962-9755701HXA as the authorized lead finish for this configuration. Contact Sparkle Electronics for solderability test data availability on specific lots.
Procuring HCPL-7851#300 for a defense SMT program requiring MIL-PRF-38534 Class H analog isolation? Sparkle Electronics stocks QML-38534 qualified hermetic isolation amplifiers across all lead configurations — through-hole, butt joint, and gull wing — with full Class H lot documentation and DLA SMD traceability. Submit an inquiry — same-day response on pricing, lot availability, lead configuration options, and documentation scope.
