ALTERA EP3C25F256I7N
- 24,624 programmable logic units for flexible signal processing implementation
- 608,256 bits of embedded block RAM for real-time data storage
- Extended operating temperature range of -40°C to +100°C
- FBGA-256 package for high-density board integration
- Support for multiple high-speed I/O standards including LVDS and SSTL
Radar and electronic warfare systems in aerospace and defense require reconfigurable processing platforms that can adapt to evolving mission requirements while operating reliably in harsh environments. The ALTERA EP3C25F256I7N Cyclone III FPGA provides a cost-effective solution with a balance of logic capacity, memory resources, and ruggedness. Its programmable architecture allows engineers to implement custom signal processing algorithms, communication protocols, and control logic in a single device, reducing system size and power consumption.
Built on a low-power process technology, this FPGA delivers high computational performance with efficient power utilization, making it suitable for weight- and power-constrained defense platforms. The embedded block RAM supports real-time data buffering and storage, minimizing the need for external memory components and reducing system latency. With its FBGA-256 package, the EP3C25F256I7N offers a high I/O count in a compact form factor, enabling seamless integration with high-speed analog-to-digital converters and other system components.
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The Altera EP3C25F256I7N is the same EP3C25 die as the E144 variant — 24,624 LEs, 66 M9K blocks, 66 18×18 multipliers, 4 PLLs — in the 256-pin FineLine BGA package, industrial speed grade I7. The F256 FBGA package provides 148 user I/Os versus 106 in the E144, making it the preferred choice when the design’s I/O count exceeds the EQFP package limit but does not require the maximum 215 I/Os available in the F324 package.
EP3C25 Package & I/O Selection Guide
| Parameter | EP3C25E144I7N | EP3C25F256I7N (this) | EP3C25F324I7N |
|---|---|---|---|
| Package | 144-pin EQFP | 256-pin FBGA | 324-pin FBGA |
| Max User I/Os | 106 | 148 | 215 |
| PCB Footprint | Largest | Medium | Largest BGA |
| Logic/Memory/DSP | Identical across all three packages |
The F256 BGA offers a smaller PCB footprint than the F324 while providing 40% more I/Os than the E144, placing it as the natural mid-point choice for I/O-moderate avionics interface boards, embedded processor co-processor cards, and industrial control FPGAs. The 65nm low-power Cyclone III process maintains low static power across the −40°C to +100°C industrial junction temperature range covered by the I7 grade. All three EP3C25 package variants share identical logic, memory, DSP, and PLL resources, enabling pin-alternative sourcing decisions driven purely by I/O count and PCB layout constraints.
FAQ
What is the difference between EP3C25F256I7N and EP3C25E144I7N?
Package only: F256 is 256-pin FBGA with 148 user I/Os; E144 is 144-pin EQFP with 106 user I/Os. Die, logic resources, memory, DSP blocks, and PLLs are identical.
Can EP3C25F256I7N and EP3C25F324I7N be used interchangeably?
Not directly — different pin counts and footprints. If I/O count permits (≤148), the F256 is preferred for its smaller PCB footprint. The F324 provides 215 I/Os for I/O-intensive designs.
What speed grades are available for EP3C25 in F256 package?
C6 (fastest), C7, C8, and I7 (industrial). I7 is the industrial grade covering −40°C to +100°C junction temperature.
What is the core supply voltage for Cyclone III devices?
1.2V VCCINT core, with VCCIO configurable from 1.2V to 3.3V per I/O bank to support mixed-voltage interfaces.
Does this device support LVDS?
Yes. Cyclone III supports emulated LVDS up to 840 Mbps on general-purpose I/O pins. Dedicated LVDS pins are available in larger packages.
What is the recommended configuration device for EP3C25F256I7N?
The EPCS64 or EPCS128 serial configuration device for AS mode, or any standard SPI flash for PS mode. The EPCQ128ASI16N or EPCS128SI16N serial configuration devices available in our catalog are compatible with Cyclone III AS configuration.
