ALTERA EP3C120F484I7N
- 120,000 logic elements for high-density signal processing
- 4.6 Mbits of embedded RAM for data-intensive applications
- 216 18x18-bit multipliers for digital signal processing
- 1.2V core voltage for ultra-low power operation
- 484-pin FBGA package with high I/O count
Modern radar and electronic warfare systems require FPGAs that balance high logic density, low power consumption, and cost-effectiveness. The ALTERA EP3C120F484I7N delivers on all three fronts, making it suitable for mid-range signal processing, real-time data analysis, and control functions in defense and industrial applications.
As part of Altera's Cyclone III series, this FPGA combines a 0.18µm manufacturing process with advanced power management features to achieve exceptional performance per watt. Its high logic density and embedded DSP blocks support complex algorithm implementation in radar beamforming, electronic countermeasures, and communication systems, while its extended temperature range ensures reliable operation in harsh environments.
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The Altera EP3C120F484I7N is the highest-density member of the Cyclone III family — 119,088 LEs, 432 M9K memory blocks (3,888 Kbit total), 288 18×18 embedded multipliers, 4 PLLs, 20 global clock networks — in the 484-pin FineLine BGA package, industrial speed grade I7. As the flagship Cyclone III device, the EP3C120 delivers the maximum logic density available in the family while remaining in a cost-effective, low-power architecture suited for defense embedded control, avionics display processing, and communications interface applications where Stratix-class power consumption is unacceptable.
Cyclone III High-Density Device Comparison
| Device | LEs | M9K Blocks | Multipliers | PLLs | Package (this OPN) |
|---|---|---|---|---|---|
| EP3C120 (this device) | 119,088 | 432 | 288 | 4 | F484 |
| EP3C80 | 81,264 | 305 | 244 | 4 | F484 |
| EP3C55 | 55,856 | 260 | 156 | 4 | F484 |
| EP3C40 | 39,600 | 126 | 126 | 4 | F484 |
The F484 package supports vertical migration across EP3C40/55/80/120, enabling board reuse across density grades. The I7 industrial speed grade covers operation from −40°C to +100°C junction temperature. Note that the EP3C120 is offered only in C7, C8, and I7 speed grades — no C6 fastest grade is available, making I7 the sole industrial option for this density. The Cyclone III 65nm low-power process delivers static power well below competing 90nm-process FPGAs, making it widely adopted in battery-operated and thermally constrained defense portable electronics. Supported in Quartus Prime with full IP library and legacy Quartus II compatibility.
FAQ
What does each field in EP3C120F484I7N mean?
EP3C = Cyclone III family; 120 = 119,088 LEs (120K class); F484 = 484-pin FineLine BGA package; I7 = industrial temperature, speed grade 7; N = lead-free (RoHS).
What is the maximum user I/O count for the EP3C120F484I7N?
In the F484 package, up to 531 maximum user I/Os are available for the EP3C120. If migrating from EP3C80 to EP3C120 using voltage-referenced I/O standards, this may be reduced to 510 — confirm against the pin-out file for the specific I/O standard used.
Is the I7 the only industrial speed grade available for EP3C120?
Yes. The EP3C120 is offered only in C7, C8, and I7 grades. The faster C6 grade is not available for this density device, and I7 is the sole industrial temperature option.
What embedded memory architecture does Cyclone III use?
M9K blocks — 9 Kbit each, configurable as single-port RAM, simple dual-port RAM, true dual-port RAM, FIFO, ROM, or shift register. The EP3C120 provides 432 M9K blocks totaling 3,888 Kbit.
Is this device supported in current Quartus Prime software?
Yes. All Cyclone III devices are supported in Intel Quartus Prime. Legacy Quartus II designs targeting Cyclone III are fully compatible with Quartus Prime device support.
What is the vertical migration path for the F484 package?
The F484 package supports vertical migration across EP3C40, EP3C55, EP3C80, and EP3C120, with identical power, ground, and dedicated configuration pin assignments enabling density upgrade or downgrade without PCB redesign.
